JEDEC UFS Ver.1.1 Standard Compliant Embedded Memories Combine up to 64GB NAND and a Controller in a Single Package

TOKYO and IRVINE, Calif., Feb. 7, 2013 — (PRNewswire) — Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it began shipping samples of its 64-gigabyte (GB) embedded NAND flash memory module equipped with a Universal Flash Storage (UFS) interface. The first in the industry^[1], the new module is fully compliant with the JEDEC UFS^[2] Ver.1.1 standard ^[3], and is designed for a wide range of digital consumer products - including smartphones and tablet PCs.

With improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high resolution video. A proven innovator in this key area, Toshiba is reinforcing its leadership role by being the first in the industry to ship samples with a 64GB UFS module. 

Samples are mainly intended for evaluation of the UFS interface and its protocol in host chipsets and by OS vendors. Toshiba will schedule mass production of the 64GB UFS module, as well as other densities in its lineup, according to market demand.

Product

Key Features

• The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
• UFS has a serial interface and scalability in terms of number of lanes and speed^[4].
• The new products are sealed in a small FBGA package, 12x16x1.2mm and have a signal layout compliant with JEDECUFS Ver.1.1.

^[1]For embedded NAND flash memory modules. Source: Toshiba, as of February 2013.
^[2]Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.
^[3]JEDEC UFS Ver.1.1 standard has already been published. The Ver.2.0 standard is now under discussion by JEDEC.
^[4]JEDEC UFS Ver.2.0 standard will support multiple-lane and interface speed.

Specifications

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more. 

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan 's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue, March, 2012).  Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm .