New Release of InspectionXpert for CATIA Balloons Both 3D Models and 2D Drawings

Autodesk Extends Invitation to Join its Second Quarter Fiscal 2011 Financial Results Conference Call

hyperMILL® certified by Autodesk Complete integration in the new Autodesk Inventor 2011 release

Kraftsman Tooling saves 35% administration time and anticipates 30% growth in turnover thanks to MyWorkPLAN

Creaform's Technology Certified by the National Institute of Metrology

CCE's EnSuite Updated to Support CATIA V5 R20, Solid Edge & 3D PDF

Firas Mohamed President IROC Technologies

Aaron Edwards, Senior Director Ansys Customer Excellence ANSYS

John Eble, VP Rambus

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024