Spatial Integrated Systems, Inc. Awarded Patent for 3D Imaging

Spatial Releases ACIS® and 3D InterOp R22, Increasing the Depth of Application Capabilities

Spatial Unveils CGM, a New Component Modeler for Modern Applications and the Geometric Engine used in V5 and V6 Products

Dassault Systemes Announces New Release of Isight for Simulation Automation and Design Optimization from SIMULIA

STAR-CCM+ and Abaqus co-simulation makes seamless fluid-structure interaction a reality.

EOS Showcases Laser-Sintering for Advanced Medical Applications at MD&M EAST 2010

Calista Redmond, CEO RISC-V

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Anthony Dawson, VP ANSYS

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

EDACafe Editorial by Sanjay Gangal A New Era in RISC-V: SiFive’s HiFive Premier P550 Paves the Way for Software Innovation

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

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SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024