Rational Technology Brings Autodesk Technology to Architects and Engineers Across the Northwest

PacifiCAD Inc. To Offer Autodesk’s AutoCAD 2011 Products

Autodesk Unveils New Service Offering to Support Rural Utility Services Standards for Autodesk Utility Design at DistribuTECH 2010

Synergis Celebrates 25 Years as Autodesk Value-added Reseller

Autodesk Launches European Clean Tech Partner Program

Autodesk Publishes Framework to Help AEC Professionals Implement BIM Process

Ricky Lau, CTO The Six Semiconductor

Calista Redmond, CEO RISC-V

Josep Montanya , CEO Nanusens

EDACafe Editorial by Roberto Frazzoli Shifting left software development; advancements in car power architectures; Japan’s semiconductor subsidies; ADI acquires Flex Logix

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Design Verification Engineer for Blockwork IT at Milpitas, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024