Akros Offers First Integrated, 2kV-Isolated, Quad-Output Power SoC

austriamicrosystems to Manufacture Triad Semiconductor’s Via-Configurable SoC Solution

New G2 Microsystems’ SoC Available Today for Designing Tomorrow’s Battery-Powered, Wi-Fi CE Devices

ARC’s Sonic Focus Audio Technology Now Available on ViXS XCode® 3290 SoC to Enable a Rich Audio/Video Consumer Experience

Socle Partners with Catena, CoreSonic to Drive Wireless SoC Platform in 65nm as Mobile Solution

Percello Introduces 16-User Femtocell SOC at the Femtocells London Event

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Lou Ternullo, Senior Director of IP Product Management Rambus

JB Baker, VP Products ScaleFlux

EDACafe Editorial by Roberto Frazzoli Shifting left software development; advancements in car power architectures; Japan’s semiconductor subsidies; ADI acquires Flex Logix

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

CAD Engineer for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025