Datakit strengthens its 3D PDF and STEP offer

Datakit updates CrossManager© 2013

Cadac Group introduces Organice 2007 R4

New Portal Launched for the Mexican CAD/CAM Community

2009 CAD-ERP Data Integration System for SolidWorks, Autodesk Inventor, AutoCAD and Navision Available

ViewPlus Technologies Replaces Previous 3D CAD Solution with PTC CoCreate

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Aaron Edwards, Senior Director Ansys Customer Excellence ANSYS

Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

EDACafe Editorial by Sanjay Gangal A New Era in RISC-V: SiFive’s HiFive Premier P550 Paves the Way for Software Innovation

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024