Luxology Announces Rhinoceros File Translator for modo

New Oce Arizona 350 GT UV Curable Flatbed Printer Includes Support for White Ink

Oce Announces Third Quarter 2008 Results

Autodesk Gallery at One Market Opens in San Francisco, Showcasing Design Process

Oce North America Introduces Desktop Color Printing Performance

Sun Microsystems Delivers Fastest x86-based 1U Server for Technical Computing Workloads and Most Expandable 2U Enterprise-Class System Powered by Intel(R) Xeon(R) Processors

Google Keynote (Google I/O ‘24) Google

Josep Montanya , CEO Nanusens

Anthony Dawson, VP ANSYS

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

Design Verification Engineer for Blockwork IT at Milpitas, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024