Autodesk Achieves One Billion Location Transactions Milestone with Oracle Products and Services

University, Technical College, and High School Students Are Invited to Submit Projects Displaying Their Creativity and Skill in Applying Design and Engineering Principles

American Institute of Architects (AIA) Announces the Release of Six New Documents Including a First of Its Kind Building Information Model Hands-on Tool

AMERICAN SOCIETY OF LANDSCAPE ARCHITECTS SELECTS 13 HONORARY MEMBERS

Avatech Solutions to Report Fiscal 2008 Fourth Quarter and Year-End Results on Monday, September 29, 2008

tvsdesign Selects BST Enterprise for Global Business Management Solution

JB Baker, VP Products ScaleFlux

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

EDACafe Editorial by Sanjay Gangal A New Era in RISC-V: SiFive’s HiFive Premier P550 Paves the Way for Software Innovation

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Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

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SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024