Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters

Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles

Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs

Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024

Silvaco Joins SMART USA Institute to Propel Digital Twin Innovations Under CHIPS Manufacturing USA Program

Marvell Technology, Inc. Reports Third Quarter of Fiscal Year 2025 Financial Results

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Ricky Lau, CTO The Six Semiconductor

Tim Vehling, Executive VP Global Sales EdgeCortix

EDACafe Editorial by Roberto Frazzoli NeurIPS; advanced packaging; OCTRAM memory; graphene interconnect; Google’s quantum advancements

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

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Bridging the Frontier by Paul Cohen ESD Alliance Kicks off “Savage on Security” Webinar Series January 23 with Warren Savage

Sr. Silicon Design Engineer for AMD at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

Design, Automation & Test in Europe - DATE 2025 at Palais des congrès de Lyon Lyon France - Mar 31 - 2, 2025