Rapidus begins installation of Japan's first NXE:3800E EUV lithography machinery for semiconductor mass production

CES 2025: SPARK Microsystems Showcases Major Advancements in Wireless Connectivity for Audio, Gaming, IoT and Medical Devices

Richardson Electronics, Ltd. Announces Two Multi-Million Dollar Contracts for its Patented Ultracapacitor Pitch Energy Modules

WiMi Develops a New Design Solution for Simulating Quantum Computing Concepts Using FPGA

QuickLogic Announces Appointment of Andy Jaros as Vice President of IP Sales

NXP to Acquire Automotive Networking Pioneer Aviva Links, Accelerating Asymmetrical ASA Multi-Gigabit Connectivity in Software Defined Vehicles

Ian Ferguson, Senior Director SiFive

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Josep Montanya , CEO Nanusens

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

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Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025