Fairview Microwave Launches Spring-Loaded Adapters for SMP, SMPM and SMPS Connectors

TDK expands multilayer inductors for automotive Power-over-Coax circuits

CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level

High Fidelity Lossless Audio Headsets with integrated WiFi

L-com Launches Line of Diffuse Photoelectric Proximity Sensors

Wise-integration Expands in North America With Ottawa Design Center to Develop Next-Gen WiseGan® Digital Solutions

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Ian Ferguson, Senior Director SiFive

Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Intel to get $7.86 billion CHIPS Act award; Risc-V-based universal processor; SMIC’s yields; Nvidia’s music generation AI model

Bridging the Frontier by Bob Smith, Executive Director The Evolution of the Semiconductor IP Market

EDACafe Editorial by Sanjay Gangal NVIDIA and Industry Leaders Unveil Groundbreaking Real-Time Digital Twin Technology

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

GPU Design Verification Engineer for AMD at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025