Toshiba's Proposed Double-Transmon Coupler for Superconducting Quantum Computers Achieves World-Class Two-Qubit Gate Performance

Avalanche Technology Announces Support for High Density Space Grade DDR4 MRAM Solutions in Mid-2025

Power Integrations Launches 1700 V GaN Switcher IC, Setting New Benchmark for Gallium Nitride Technology

OMNIVISION Debuts Industry’s Smallest-Footprint Sensor for Presence Detection, Facial Recognition and Always-On

MACOM Selected to Lead Advanced GaN-on-SiC Semiconductor Technology Development Project

NVIDIA and Sherwin-Williams Set to Join Dow Jones Industrial Average; Vistra to Join Dow Jones Utility Average

Andrew Baker , CEO Orca Semi

Firas Mohamed President IROC Technologies

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

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Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025