CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level

High Fidelity Lossless Audio Headsets with integrated WiFi

L-com Launches Line of Diffuse Photoelectric Proximity Sensors

Wise-integration Expands in North America With Ottawa Design Center to Develop Next-Gen WiseGan® Digital Solutions

Durable New High-Frequency Connectors Fit 0.034 and 0.047 Semi-Rigid Coax Cables

SECO AND RASPBERRY PI ENTER INTO A STRATEGIC PARTNERSHIP TO EXPAND THEIR INDUSTRIAL IOT OFFERINGS

Lou Ternullo, Senior Director of IP Product Management Rambus

Calista Redmond, CEO RISC-V

Josep Montanya , CEO Nanusens

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025