Moreh, AI Software Startup partners with Tenstorrent, AI chip company to Challenge NVIDIA in AI Data Center Market

LG AND TENSTORRENT EXPAND PARTNERSHIP TO ENHANCE AI CHIP CAPABILITIES

Preferred Networks Inc. adopts Siemens’ PowerPro software for next-generation AI chip design

Sondrel announces Advanced Modelling Process for AI chip designs

NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks

Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips

Calista Redmond, CEO RISC-V

John Eble, VP Rambus

Simon Rance, Director of Product Management and Strategic Marketing Keysight Technologies

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Sr. Silicon Design Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025