Solidigm Extends AI SSD Portfolio Leadership with Lightning-Fast Additions to their D7 Product Line

Keysight, Ettifos, and Autotalks Make First 3GPP Release 16 Sidelink Radio Interoperability Connection

New SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps

UCIe Consortium Releases 2.0 Specification Supporting Manageability System Architecture and 3D Packaging

GlobalFoundries Reports Second Quarter 2024 Financial Results

Samsung Electronics Begins Mass Production of Industry’s Thinnest LPDDR5X DRAM Packages for On-Device AI

Anthony Dawson, VP ANSYS

Jeff Wilson, Director Siemens EDA

Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

Design Verification Engineer for Blockwork IT at Milpitas, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024