Qualcomm and Sequans Reach Agreement on Sale of 4G IoT Technology

Pasternack’s New Spring-Loaded Adapters Enhance SMP, SMPM and SMPS Series

Anritsu Unveils a New Microwave Spectrum Monitor Module MS27200A Power your system with Anritsu’s spectrum analyzer

Pasternack’s New Gooseneck Omni Antennas Bring Flexible Signal Optimization

Telit Cinterion Enables Next-Generation Cellular LPWA Deployments on AT&T with the ME310M1 IoT Module

Integra Optics’ New 10G SFP+ Transceiver Offers 120 km Reach

Ricky Lau, CTO The Six Semiconductor

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025