Odys Aviation and MWASALAT Announce Partnership to Develop Aerial Logistics Programs in the GCC in 2025 by Operating Odys’ Hybrid-Electric VTOL Aircraft, Laila

D-Fend Solutions Upgrades EnforceAir2 C-UAS with User Interface Enhancements, AI-based Mitigation Engine, and New "Disrupted" Environments Mode

DJI Agriculture Annual Report Finds the Global Agricultural Drone Industry is Booming

ParaZero Received ASTM F3322-22 Standard Approval According to FAA New Regulations Allowing Flight Operation Over People

OKSI Announces their AI/ML Technology Portfolio for Unmanned Airborne Platforms: OMNISCIENCE

UAS Drone Corp. Advancing Commercial Activity Following Successful Pilot Completion for IC Drone with IEC

JB Baker, VP Products ScaleFlux

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Ricky Lau, CTO The Six Semiconductor

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Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

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SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024