Scrona's Patrick Galliker to Speak at FLEX Conference

Special Competitive Studies Project report spearheaded by former Google CEO Eric Schmidt calls out Michigan-based Project DIAMOnD as distributed 3D printing model for DoD

nTop Announces Major Software Release and Adds Five New Integration Partners to Advance the Design-to-Manufacturing Workflow

Stratasys and AM Craft Partner to Drive Growth in 3D Part Manufacturing for Aviation

Desktop Metal to Showcase New Breakthroughs in Production Metal and Ceramic Binder Jet 3D Printing at RAPID + TCT

NUBURU Announces Strategic 1-for-40 Reverse Stock Split to Enhance Shareholder Value and Return to Trading on NYSE American

Ricky Lau, CTO The Six Semiconductor

JB Baker, VP Products ScaleFlux

Calista Redmond, CEO RISC-V

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025