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Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity

Ambarella’s Latest 5nm AI SoC Family Runs Vision-Language Models and AI-Based Image Processing With Industry’s Lowest Power Consumption

Scott Monroe Appointed as Vice President of Sales at Encore Semi

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e-peas showcases complete solutions for batteryless design with industry-leading ecosystem partners at Embedded World

Vincent Bligny, CEO Aniah

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025