Teledyne e2v HiRel Releases Enhanced Plastic UHF to S-Band (0.3 GHz to 4 GHz) Ultra-Low Power Low Noise Amplifier for New Space Applications

ROHM Introduces Zero-Drift Operational Amplifier with High Accuracy Regardless of Temperature Changes

Teledyne e2v HiRel Releases Single-Supply, Radiation-Tolerant, UHF to S-Band (0.3 GHz to 3 GHz), Ultra-Low Noise Amplifier for Space Applications

Fairview Microwave Introduces Series of 5G Amplifiers

Teledyne e2v HiRel Releases Best-in-Class, Ultra-Low Noise Amplifier for Space Applications

Mitsubishi Electric to Ship Samples of GaN Power Amplifier Module for 5G Massive MIMO Base Stations

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Ricky Lau, CTO The Six Semiconductor

JB Baker, VP Products ScaleFlux

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025