KDPOF Endorses IEEE 802.3cz Standard Entering the Finishing Straight of Final Release

The complete SEGGER ecosystem fully supports ST’s new MPUs

sureCore announces range of off-the-shelf, ultra-low power memory IP to help fast-track power critical designs

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement

Mouser Sponsors 2023 Global Create the Future Design Contest

Weebit Nano partners with University of Florida's Nino Research Group to examine effects of radiation on Weebit ReRAM

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Josep Montanya , CEO Nanusens

Andrew Baker , CEO Orca Semi

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

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Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

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Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025