IMAX and AEON to Further Expand Partnership with Seven New IMAX with Laser Locations in Japan this Year

FLOW-3D World Users Conference 2023 to take place in Strasbourg, France

ANNIE AWARDS™ NOMINATIONS ANNOUNCED TODAY!

Apple unveils M2 Pro and M2 Max: next-generation chips for next-level workflows

Dassault Systèmes Presents Urban Renaissance, Featuring a 3D Mapping Project Illustrating the City of Tomorrow by Korean Artist Yiyun Kang

PixCap Launches Upgraded Web-Based Platform That Allows Anyone to Create Professional 3D Designs

Tim Vehling, Executive VP Global Sales EdgeCortix

Calista Redmond, CEO RISC-V

JB Baker, VP Products ScaleFlux

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

EDACafe Editorial by Sanjay Gangal EDACafe Industry Predictions for 2025 – Logic Fruit

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Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

CAD Engineer for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025