Teledyne e2v HiRel Releases Best-in-Class, Ultra-Low Noise Amplifier for Space Applications

USound Reveals High-performing ASIC Linear Audio Amplifier to Boost the Battery Life of TWS, Hearing Aids, and Smart Glasses

Semtech Releases 250μm Channel Pitch FiberEdge® Linear Transimpedance Amplifier (TIA) for 400G and 800G Data Center Applications at ECOC 2022

Semtech Announces Production of Best-in-Class FiberEdge® Linear Transimpedance Amplifier for 400G and 800G Data Center Applications

Efficient Power Conversion (EPC) and innosonix Address Power Consumption and Overall Efficiency Demands for High-end Audio Amplifier Application with eGaN FET Design

Pasternack Unveils New Mil-Grade Coaxial Packaged Variable Gain Amplifiers

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Firas Mohamed President IROC Technologies

Ian Ferguson, Senior Director SiFive

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025