OFC 2023 Announces Global Leaders in Telecommunications, Computer Networking and Material Science to Deliver Plenary

FIT Introduces QSFP-DD800 Connector / DAC Solutions at OFC 2022

Go!Foton to Present New Optical Switch at OFC 2022

MaxLinear Partners with MACOM and II-VI to Showcase 100Gbps Per Lane Multi-Mode Links at OFC

Source Photonics Expands Portfolio with 50G PAM4 SFP56 Transceivers for 5G Fronthaul Wireless Deployment at OFC 2022

New at OFC 2022: Quantifi Photonics Announces PXI-Based PAM4 BERT, Brings Unprecedented Density to Optical Transceiver Test as the Market Moves to 400G and Beyond

Josep Montanya , CEO Nanusens

Ricky Lau, CTO The Six Semiconductor

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025