3D Systems Announces Closing of Upsized Offering of $460.0 Million of 0% Convertible Senior Notes due 2026, Including Full Exercise of Initial Purchasers’ $60.0 Million Option to Purchase Additional Notes

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3D Systems Announces Offering of $350.0 Million of Convertible Senior Notes due 2026

Mantle Strengthens Leadership Team with Additions of Dana McCallum as VP of Sales and Mark Sloan as VP of Manufacturing

Hexagon democratises engineering simulation further with first Image-Recognition AI for Computer-Aided Engineering

IMTS Is the Additive Manufacturing Destination for 2022

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SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

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EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

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Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

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Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025