Panzura Appoints Former SAP and EMC Veteran to Lead Global Sales Channels

Woolpert Selected to Renovate Atwood Lake Park Activity Center and Design Tappan Lake Park Welcome Center

Dassault Systèmes to Unveil Its Next “Design for Life” Installation at London’s Design Museum

AECOM to provide architecture and engineering services for Kennedy Space Center and other NASA facilities

AIA and Anguleris partner to enhance building product research and selection

iOFFICE + SpaceIQ Announces Strategic Investment by Autodesk

Firas Mohamed President IROC Technologies

Josep Montanya , CEO Nanusens

Lou Ternullo, Senior Director of IP Product Management Rambus

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

EDACafe Editorial by Sanjay Gangal A New Era in RISC-V: SiFive’s HiFive Premier P550 Paves the Way for Software Innovation

Sr. Silicon Design Engineer for AMD at Santa Clara, California

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GPU Design Verification Engineer for AMD at Santa Clara, California

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SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024