Impossible Objects Enters Joint Development Agreement to Produce New High-Performance Materials for 3D Printing

Additive Manufacturing Users Group Presents DINO Awards to Four Members

Additive Manufacturing Users Group's 2021-2022 Board Announced

Hawk Ridge Systems Partners with Exxar, Adding Virtual Reality Software to Their 3D Design Portfolio

Formlabs Doubles $2 Billion Valuation with Close of $150 Million Series E Led By SoftBank Vision Fund 2

Ultimaker adds PETG for industrial 3D printing to Platform

Ricky Lau, CTO The Six Semiconductor

Firas Mohamed President IROC Technologies

Lou Ternullo, Senior Director of IP Product Management Rambus

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024