Paperless Parts Launches Advanced Analytics Feature to Unlock Next-Level Intelligence and Help Manufacturers Make Impactful Business Decisions

Worcester Polytechnic Institute Researchers Helping U.S. Military Optimize Mobile Manufacturing Labs; Could Enable Remote Units to Turn Waste Metal Into Replacement Parts

ADDING MULTIMEDIA Impossible Objects and Ricoh 3D Partner to Produce High-Strength, Low-Cost 3D Printed Parts for Industrial Customers Across Europe

Impossible Objects and Ricoh 3D Partner to Produce High-Strength, Low-Cost 3D Printed Parts for Industrial Customers Across Europe

Stratasys Direct and Xometry Partner to Deliver High-Performance 3D Printed Parts on Demand

Hexagon streamlines reverse engineering from metrology to manufacturable parts with REcreate

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Josep Montanya , CEO Nanusens

Andrew Baker , CEO Orca Semi

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025