ALP.Lab and Cepton Deploy Lidar Intelligence to Enable Smart Intersections and Road Safety in Europe

May Mobility Selects Ouster’s Lidar Sensors for Autonomous Shuttle Platform

SVI Begins Development of Multi-Modal Dual Chirp FMCW 4D LiDAR System for Remote ID and Threat Detection Using Heartbeat, Breathing Rate and Gait Following Issuance of Key Patent

Seoul Robotics Partners With Mando on Mass Production of 3D LiDAR and Imaging Radar

LeddarTech Partners With Seoul Robotics to Deliver Robust Solid-State LiDAR-Based Perception Solutions

Meet the Next Generation of Industry Leading Drone LiDAR Survey Equipment from Microdrones

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Calista Redmond, CEO RISC-V

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EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

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CAD Engineer for Nvidia at Santa Clara, California

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SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024