Industry's Smallest Quad-Output SIMO Power Management IC by Maxim Integrated Achieves 85 Percent Higher Power Density

STMicroelectronics Collaborates with Qualcomm Technologies on Unique Sensor Solutions for Next-Gen Mobile,  Connected PC, IoT, and Wearable Applications

New Automotive Primary DC/DC Converters Offer Stable Output, Even with Fluctuating Input Voltage

Micron Ships World’s First 176-Layer NAND, Delivering A Breakthrough in Flash Memory Performance and Density

Diodes Incorporated Reports Third Quarter 2020 Financial Results

Motor Development Kit from ON Semiconductor Prioritizes Energy Efficiency

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Calista Redmond, CEO RISC-V

Tim Vehling, Executive VP Global Sales EdgeCortix

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025