2nd Gen AMD EPYC™ Processors Power New Oracle Cloud Infrastructure Compute E3 Platform

Supermicro Introduces Industry's Broadest Portfolio of Systems Based on the 2nd Gen AMD EPYC™ Processors with 27 World Record Performance Benchmarks Achieved

2nd Gen AMD EPYC™ Processors and AMD Radeon Instinct™ MI25 GPUs Extend Microsoft Azure High Performance Cloud Offerings

BOXX Upgrades Workstation with 3rd Gen AMD Ryzen™ Threadripper™ Processor

Green Hills Software and NXP Team Up on Safe and Secure Platform for Vehicle Networking

Silicon Labs and Quuppa Team Up to Deliver Best-in-Class Bluetooth Location Solution

Ricky Lau, CTO The Six Semiconductor

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

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Sr. Silicon Design Engineer for AMD at Santa Clara, California

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025