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DesignCon Expands Into Artificial Intelligence, Automotive, 5G, IoT, and More For 2020 Edition

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UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions

Graphcore leveraged Mentor's Questa technologies to verify massive Colossus GC2 AI processor

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Ricky Lau, CTO The Six Semiconductor

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Sr. Silicon Design Engineer for AMD at Santa Clara, California

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GPU Design Verification Engineer for AMD at Santa Clara, California

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025