Renesas Electronics Launches RX23E-A Group, First RX Microcontrollers Built-In Industry-Leading Analog Front End for High-Precision Sensing and Measurement Equipment

Intel Brings the Most Integrated Platform-Wide Leadership to PCs with New 10th Gen Intel Core Processors and Project Athena at COMPUTEX 2019

Faraday Showcases FinFET ASIC Solutions and SoCreative!V™ SoC Platform at DAC 2019

INGChips selects Dolphin Integration’s Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash

Credo First to Demonstrate 7nm, 112G XSR SerDes

SmartDV Speeds Delivery of its New CXL Verification IP

Josep Montanya , CEO Nanusens

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Ian Ferguson, Senior Director SiFive

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025