MACOM and CIG to Demonstrate Complete 200G Optical Module Solution at OFC 2019, Delivering Low Power and Cost Economics for Data Center Applications

MACOM Announces New Dual and Quad Channel 64GBaud TIA Solutions for 600G Applications

Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process

New Power-Supply Transformers Complement Power Integrations’ SCALE-iDriver Gate-Driver IC Family

Broadcom Delivers Industry’s First Complete 7nm PAM-4 Optical Platform for Hyper-Scale Data Center and Cloud Infrastructure

Ixia, a Keysight Business, and Innovium Collaborate to Demonstrate Interoperability between Switches and Test Equipment at up to 400GE Speeds at OFC 2019

John Eble, VP Rambus

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Josep Montanya , CEO Nanusens

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Sr. Silicon Design Engineer for AMD at Santa Clara, California

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Design Verification Engineer for Blockwork IT at Milpitas, California

CAD Engineer for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025