News
»
EDA News
Embedded, IP & SoC News
Subscribe
Submit News
Events
»
EDA Events
Submit New Event
Purchase Webinar Listing
Editorial
Jobs
IP
»
Browse
Submit IP
Videos
»
EDA Videos
Submit New Video
Submit New YouTube Video
Blogs
Books
Advertise
»
EDACafe Media Kit
Banner Ad Specifications
eMail Blast Specifications
Inquire
Email this story to a friend:
"
ICNews - Bipolar Transistors from Diodes Incorporated Feature a 3.3mm x 3.3mm Package and Enable Higher Power Density
"
*
Friend's Email :
*
Your Full Name :
*
Your Email Address :
Personal Message :
Characters remaining: 500
Your IP address is : 13.58.40.171
Related News
New Series of High-Side/Low-Side Gate Drivers from Diodes Incorporated Delivers Higher Performance in an SO-8 Package
STMicroelectronics and Virscient Collaborate to Enable Faster Delivery of Connected-Car Systems with Telemaco3P Automotive Application Processors
Cypress Processing Solution with Built-in System Layer Security Fortifies IoT Application Design
Cypress ModusToolbox Suite Eases IoT Design Complexity with Third-Party Platform Development Flows, Including Arm Mbed OS
CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab
Imagination and Andes collaborate to enable ultra-low power connected microprocessors for IoT
More News
Featured Video
Alain-Sam Cohen, Engineering Manager
DeepPCB
John Ferguson, Product Management Director
Siemens
Ian Ferguson, Senior Director
SiFive
Adam Tilton, CEO
Driver
Tim Vehling, Executive VP Global Sales
EdgeCortix
Vijay Chobisa, Senior Director
Siemens EDA
Colin Scholefield, Senior Director of Product Marketing
Boston Semi Equipment
Dr. Jason Cong, Professor
UCLA
John Heinlein, CMO
Sonatus
Submit
|
More Videos
Sponsored Videos
Andrew Baker , CEO
Orca Semi
Calista Redmond, CEO
RISC-V
Lou Ternullo, Senior Director of IP Product Management
Rambus
Submit
|
More Videos
Editorial
EDACafe Editorial
by Roberto Frazzoli
Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution
More
Editorial
Latest Blog Posts
Siemens EDA
by Sanjay Gangal
Enhance power reliability through design-stage layout optimization
Bridging the Frontier
by Paul Cohen
Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet
Industry Predictions
by Sanjay Gangal
Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites
EDACafe Editorial
by Sanjay Gangal
Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development
More EDA Blogs
Jobs
CAD Engineer
for
Nvidia
at Santa Clara, California
Sr. Silicon Design Engineer
for
AMD
at Santa Clara, California
GPU Design Verification Engineer
for
AMD
at Santa Clara, California
Design Verification Engineer
for
Blockwork IT
at Milpitas, California
Senior Firmware Architect - Server Manageability
for
Nvidia
at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU
for
Nvidia
at Santa Clara, California
Submit Resume
|
Post Jobs
|
More Jobs
Upcoming Events
SEMICON Japan 2024
at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024
PDF Solutions AI Executive Conference
at St. Regis Hotel San Francisco - Dec 12, 2024
DVCon U.S. 2025
at United States - Feb 24 - 27, 2025
DATE 2025 - Design, Automation and Test in Europe Conference
at France - Mar 31 - 2, 2025
Submit
|
More Events
© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 —
Contact Us
, or visit our other sites:
Privacy Policy
Advertise