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MuxLab Leverages intoPIX’s Ultra Low Latency JPEG 2000 to Manage 4K60 on 1GbE Networks

Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips

Gartner Says Four Chinese OEMs Were Among the Top 10 Global Semiconductor Customers in 2018

John Chong of Kionix Named Chair of MEMS & Sensors Industry Group Governing Council

Fast Digitizer from Spectrum enables breakthrough in cell sorting

Firas Mohamed President IROC Technologies

Simon Rance, Director of Product Management and Strategic Marketing Keysight Technologies

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

GPU Design Verification Engineer for AMD at Santa Clara, California

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Sr. Silicon Design Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

CAD Engineer for Nvidia at Santa Clara, California

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025