Vayyar Launches Groundbreaking New mmWave 3D Imaging System on a Chip (SoC) Evaluation Kit

DOCOMO AI Agent API now available on MT8516 Voice Assistant Devices Powered by MediaTek

Qualcomm Announces New Flagship Snapdragon 855 Mobile Platform - A New Decade of 5G, AI, and XR

Telco Systems and Arm Advance Strategic Partnership for Joint uCPE Platform Based on New Arm Neoverse Architecture

Renesas Electronics Announces Industry’s First USB-C™ Combo Buck-Boost Battery Charger for Mobile Computing Systems

mtes Neural Networks Selects QuickLogic's QuickAI HW/SW Platform for AI-Enabled Endpoint Devices

Andrew Baker , CEO Orca Semi

Calista Redmond, CEO RISC-V

Lou Ternullo, Senior Director of IP Product Management Rambus

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025