Vidatronic Signs Schoenduve Corporation as Its Sales Representative for Northern California and Nevada

Xilinx and Huawei Announce the First FPGA Cloud-based Real-time Video Streaming Solution in China

CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan

Socionext Develops World's First HDMI 2.1 Compatible Video Processing Chips

Aupera Technologies Disrupts Online Video Processing with New Platform Powered by Xilinx

Arasan Chip Systems Relocates it’s Corporate Headquarters to accommodate future growth

JB Baker, VP Products ScaleFlux

Calista Redmond, CEO RISC-V

Vincent Bligny, CEO Aniah

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

GPU Design Verification Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025