MaxLinear’s XR9240 Data Compression and Security Coprocessor Adds Support for Dell EMC VMAX All-Flash Storage Arrays

TI simplifies space-constrained automotive application designs with robust, reliable 100BASE-T1 Ethernet PHY

STATS ChipPAC Expands AEC-Q100 Qualification of eWLB for Automotive Applications

MACOM Reports Fiscal Second Quarter 2018 Financial Results

SAFERTOS Supports Integration for the New STM32 Functional Safety Software Test Library from STMicroelectronics

MagnaChip Introduces Third-Generation 40-Nanometer Mobile OLED DDIC for Smartphone Displays Without Bezels

Anthony Dawson, VP ANSYS

Firas Mohamed President IROC Technologies

Calista Redmond, CEO RISC-V

EDACafe Editorial by Roberto Frazzoli Intel to get $7.86 billion CHIPS Act award; Risc-V-based universal processor; SMIC’s yields; Nvidia’s music generation AI model

Bridging the Frontier by Bob Smith, Executive Director Happy Thanksgiving from the ESD Alliance, a SEMI Technology Community!

EDACafe Editorial by Sanjay Gangal NVIDIA and Industry Leaders Unveil Groundbreaking Real-Time Digital Twin Technology

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

Design Verification Engineer for Blockwork IT at Milpitas, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025