Arteris FlexNoC® Licensed by Canaan Creative for Artificial Intelligence ASICs

New MIPS I7200 Processor Core Delivers Unmatched Performance and Efficiency For Advanced LTE/5G Communications And Networking IC Designs

Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications

PathPartner Technology unveils FPGA based HEVC & HEIF 4K Decoder on Amazon AWS EC2 Cloud

GlobalSign’s Cloud-based, Highly Scalable PKI Solution integrated with Arm Mbed Cloud

Achronix’s Speedcore eFPGA Devices to be Highlighted at TSMC 2018 North America, China Technology Events in May

Calista Redmond, CEO RISC-V

Andrew Baker , CEO Orca Semi

Anthony Dawson, VP ANSYS

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025