Argus Worldwide Corp. signs Memorandum of Understanding to acquire India based technology innovator Tejovat Technologies Pvt Ltd

Epiq Solutions Unveils Highly Integrated RF + Linux® Module to Simplify Wireless Product Development Cycle

DapTechnology Releases 1394/AS5643 IP for Microsemi IGLOO2 and SmartFusion2 FPGA Devices

CAST and Achronix Enable Processing from Data Center to the Edge with Lossless Compression IP

Microsemi Achieves QML Class Q Qualification for its RTG4 High-Speed Radiation-Tolerant FPGAs

intoPIX Boosts the IP Media Production at NAB 2018: Demonstrating the New SMPTE ST 2110 Standards Running Both on Soft- and Hardware with TICO SDKs and FPGA IP-Cores Respectively

Vincent Bligny, CEO Aniah

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Simon Rance, Director of Product Management and Strategic Marketing Keysight Technologies

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025