BOXX Introduces Next Generation Workstation with 8th Gen Intel at Autodesk University

Intel Editorial: Passengers Have a Lot to Say About Self-Driving Cars – We Should Listen

Intel and Mobileye Offer Formula to Prove Safety of Autonomous Vehicles

Intel CEO Brian Krzanich to Keynote at CES 2018

Intel Eases Use of FPGA Acceleration: Combines Platforms, Software Stack and Ecosystem Solutions to Maximize Performance and Lower Data Center Costs

Intel Offers Innovative Approach to IoT Scaling and Security

Lou Ternullo, Senior Director of IP Product Management Rambus

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Design Verification Engineer for Blockwork IT at Milpitas, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

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GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025