Uniquify to Exhibit and Present at D&R IP SoC Day in Shanghai on Sept. 14

HSA Foundation, AMD Headlining HSA Technologies Tutorial at 26th International Conference on Parallel Architectures and Compilation Techniques

QuickLogic Provides EOS S3 Sensor Processing Platform Update

MACOM Affirms PON Leadership With the Industry’s Broadest Portfolio of High-Performance 10G Products Enabling Mainstream Deployment of 10G PON

MACOM Announces Industry’s First and Only End-to-End 100G Single Lambda Solution Scalable to 400G for Cloud Data Centers

Advantest Sells V93000 Platform with Universal Analog Pin Module to TDK-Micronas for Testing Full Range of Automotive Sensors

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Ricky Lau, CTO The Six Semiconductor

Josep Montanya , CEO Nanusens

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025