HSA Foundation, AMD Headlining HSA Technologies Tutorial at 26th International Conference on Parallel Architectures and Compilation Techniques

Renesas Synergy™ Platform Strengthens Security and Expands IoT Device-to-Cloud Connectivity

Stratix 10 FPGA: REFLEX CES Introduces the Widest Range of Boards Based on Stratix 10 GX and SoC technology from Intel PSG

Socionext Partners with Advantech to Offer High-Density, Low-Cost Media Cloud Server Solutions

Kilopass Anti-Fuse NVM OTP IP Designed into Tire Pressure Sensor SoC Manufactured on TSMC 55LP Process Node Now Shipping in High Volume

Qualcomm Brings Fast, Exceptional Connectivity to Samsung Premium QLED TVs

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

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SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

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Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025