Intel CEO To Keynote Global Automotive Summit In Detroit

Oracle's New SPARC Systems Deliver 2-7x Better Performance, Security Capabilities, and Efficiency than Intel-based Systems

Intel Labs Contributes Mobile Core (vEPC) Reference Software to the CORD™ Project

Honeywell Launches UAV Industrial Inspection Service, Teams With Intel On Innovative Offering

Moortec News Cambricon employs Moortec’s embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips

Intel Delivers ‘Real-Time AI’ in Microsoft’s New Accelerated Deep Learning Platform

JB Baker, VP Products ScaleFlux

Ian Ferguson, Senior Director SiFive

Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025