Mentor's Tessent VersaPoint test point technology helps Renesas reduce cost and improve quality

Mentor's New Tessent MissionMode Enables In-System Test and Diagnosis of Automotive ICs

Mentor announces 2017 Don Miller Award winners for system-level thermo-fluid design excellence

Intel Custom Foundry certifies Mentor physical verification tools for 22FFL FinFET low power process

Mentor extends solutions for TSMC InFO and CoWoS design flows to help customers continue IC innovations

Synopsys Experts, Customers and Partners to Present the Latest Trends and Technologies in Embedded Processor Solutions

Calista Redmond, CEO RISC-V

Vincent Bligny, CEO Aniah

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

EDACafe Editorial by Roberto Frazzoli NeurIPS; advanced packaging; OCTRAM memory; graphene interconnect; Google’s quantum advancements

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

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Bridging the Frontier by Paul Cohen ESD Alliance Kicks off “Savage on Security” Webinar Series January 23 with Warren Savage

Sr. Silicon Design Engineer for AMD at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

Design, Automation & Test in Europe - DATE 2025 at Palais des congrès de Lyon Lyon France - Mar 31 - 2, 2025