Broadcom Announces Shipments of World’s First 16nm and Highest Throughput Knowledge-based Processors for Next Generation Routers and Switches

Imagination’s Ensigma wireless communications IP achieves Wi-Fi CERTIFIED™ certification on chip that powers Creator Ci40 board

ROHM's New High Voltage Zener Diode Lineup

Transphorm's Fully-Packaged GaN FETs Available Now through Digi-Key's Global Websites

Peraso Releases W120 WiGig® Compliant Phased Array Chipset

Faraday Readies MCU ASIC Migration Path with 55nm eFlash

Magdy Abadir, CEO Suitera

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

CAD Engineer for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025