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MIPI Alliance Gives Members First Access to MIPI I3C Interface Specification for Sensor Applications

Amkor Technology Reports Financial Results for the Second Quarter 2016

IBM Lab-on-a-Chip Breakthrough Aims to Help Physicians Detect Cancer and Diseases at the Nanoscale

Altair's CAT-1 Chipset Completes Interoperability Testing by NTT DOCOMO, Accelerating Internet of Things in Japan

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Josep Montanya , CEO Nanusens

Firas Mohamed President IROC Technologies

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025