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Alma Technologies Adds Three New Ultra High Throughput H.264 Encoders to its UHT™ IP Product Line

EEMBC Benchmark Targets Heterogeneous Processor Architectures for Automotive Vision, Compute, and Mobile Imaging

Renesas Electronics Develops Two-Port On-Chip SRAM Specialized in Improving Video Processing Performance of Vehicles for the Autonomous-Driving Era

New Analog Devices SHARC® Processor Platform Delivers Superior Sound Experience in Audio System Applications

'NANO KOREA 2016', Largest NANO Technology Exhibition in Korea, from July 13th

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Vincent Bligny, CEO Aniah

JB Baker, VP Products ScaleFlux

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

CAD Engineer for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

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Design Verification Engineer for Blockwork IT at Milpitas, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025