Toshiba Launches Current-Feedback 4ch Power Amplifier IC for Car Audio with Built-In Full-Time Offset Detection

Toshiba Launches Opto-Isolated IGBT Gate Pre-Driver IC for In-Vehicle Inverters

Teledyne to Acquire Quantum Data

Renesas Electronics Delivers USB Power Delivery Controller Supporting USB Power Delivery 3.0

InnoSwitch-CE Switcher ICs from Power Integrations Optimized for Efficiency and Standby Power Performance

JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

Vincent Bligny, CEO Aniah

JB Baker, VP Products ScaleFlux

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

CAD Engineer for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025